Senior Field Service Engineer — Leading Semiconductor Fab

Roles & Responsibilities

Assignment Highlights

• Execute on-site installation, commissioning, and preventive maintenance of semiconductor process equipment at premier global fabrication facilities, including assignments at Taiwan’s advanced manufacturing hub, TSMC.
• Rapidly diagnose and resolve complex equipment issues to minimize production downtime in high-volume fab environments.
• Support and maintain Etch, Clean, and Deposition systems.
• Troubleshoot and service Pick & Place, Die Bonding, Handler, and Plating equipment with strong root-cause analysis capability.
• Work extensively with HT Power Supplies, Vacuum Modules, Plasma/RF systems, Gas Delivery Systems, and Chiller/Cooling units.
• Lead complete equipment installation and de-installation cycles, assuming full responsibility from project initiation through final acceptance.
• Collaborate closely with international engineering teams, vendors, and fab management on-site.
• Maintain strict adherence to EHS standards within cleanroom and semiconductor manufacturing environments.
• Prepare accurate and detailed technical service reports following each assignment or escalation.

Qualifications

• Diploma or Degree in Electrical Engineering, Electronic Engineering, Semiconductor Engineering, or a related technical discipline.
• 6–20 years of hands-on experience in equipment maintenance, operations, or field service within semiconductor or high-technology industries.
• Demonstrated employment stability, ideally 3–5 years with one employer (preference for consistent career progression).
• Proven troubleshooting experience with semiconductor frontend or backend equipment, including:
  • Pick & Place systems
  • Die Bonding machines
  • Handler equipment
  • Plating systems
  • Etch, Implant, HT Power Supply, Vacuum, RF/Plasma, Gas Controls, or Chiller/Cooling systems (advantageous)
• Strong analytical troubleshooting skills with a systematic, problem-solving mindset.
• Capable of managing projects independently within fast-paced fab environments.
• Willing to travel up to 75% to Taiwan, including long-term assignments (9-month rotation or permanent placement at Taiwan hubs such as TSMC).
• Open to overseas deployment at other leading semiconductor fabrication facilities.